Circular Coating Device "RS Coater"
Free circular coating with a unique slit die! A new product has arrived to replace the Spiral Coater!
The "RS Coater" is a device that allows for free circular coating using a unique slit die. In addition to circular shapes, it can achieve free coating shapes that are not dependent on substrate shapes such as squares and octagons. The time required for coating a φ300mm wafer is only 30 seconds, boasting high throughput and achieving excellent quality without bubbles. 【Features】 ■ Capable of thick film coating of high-viscosity liquids (thick coatings of several hundred micrometers can be applied in one go) ■ Excellent embedding capability for patterns (with few voids) ■ No need for EBR (Edge Back Rinse), reducing the number of processes ■ Achieves overwhelming liquid-saving (the amount of coating liquid used is less than one-third of that of a spin coater) ■ Significantly reduces the amount of cleaning liquid and waste liquid, enabling more eco-friendly production ■ Capable of coating irregular materials and shapes We also offer system proposals. Example process flow: Load Port (EFEM) → Alignment → Coater → BAKE → CP → Load Port (EFEM) Drying Process Option: VCD (Vacuum Drying Device) Firing Process Option: Can be combined with Cure Ovens and others *For more details, please refer to the PDF document or feel free to contact us.
- Company：中外炉工業
- Price：Other
